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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC8102T
RF AMPLIFIER IC FOR 150 MHz TO 330 MHz PAGER SYSTEM
DESCRIPTION
PC8102T is a silicon monolisic integrated circuit designed as RF amplifier for 150 MHz to 330 MHz pager system.
Due to 1 V supply voltage, this IC is suitable for low voltage pager system. The package is a 6 pin mini mold suitable for high-density surface mounting. This IC is manufactured using NEC's 20 GHz fT NESATTM III silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials contribute excellent DC, AC performance. Thus, this process is utilized for 1 V voltage IC.
FEATURES
* 1 V supply voltage: VCC = 0.9 V to 2.0 V * Low noise figure: 2.3 dBTYP. @ fin = 150 MHz (with external matching circuit to optimize NF) * Low current consumption: ICC = 0.5 mATYP. @ VCC = 1.0 V * Gain available frequency: fRF = 150 MHz to 330 MHz (with external matching circuit) * High-density surface mounting: 6 pin mini mold
ORDERING INFORMATION
PART NUMBER PACKAGE 6 pin mini mold MARKING C2B SUPPLYING FORM Embossed tape 8 mm wide. Pin 1, 2, 3 face to perforation side of tape. QTY 3 kp/Reel
PC8102T-E3
* For evaluation sample order, please contact your local NEC sales office. (Order number: PC8102T).
PIN CONNECTIONS
(Top View) 3 2 1 (Bottom View) 4 5 6 4 5 6 3 2 1 1: 2: 3: 4: 5: 6: INPUT GND OUTPUT VCC C1 C2
C2B
Caution Electro-static sensitive devices
Document No. P11501EJ2V0DS00 (Previous No. ID-3534) Date Published May 1996 P Printed in Japan
(c)
1996
PC8102T
INTERNAL BLOCK DIAGRAM
3
4
2
5
1
6
SYSTEM APPLICATION EXAMPLE AS PAGER
150 MHz to 330 MHz
PC8102T
PC8103T
BPF BPF IF
2
PC8102T
PIN EXPLANATION
SUPPLY VOLTAGE (V) -- PIN VOLTAGE (V) 0.75
PIN NO.
NAME
FUNCTION AND APPLICATION
EQUIVALENT CIRCUIT
1
INPUT
RF signal input pin. This pin should be externally equipped with matching circuit in accordance with desired frequency. This ground pin must be connected to the system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. Track length should be kept as short as possible. Amplified signal output pin. This pin should be externally equipped with matching circuit in accordance with desired frequency.
2
GND
0
--
3 1
3
OUTPUT C2 pin voltage must be applied through external matching inductor VCC 0.9 to 2.0
--
2
6
5
4
4
--
Supply voltage pin. Connect bypass capacitor (eg 1000 pF) to minimize ground impedance. Ground with capacitance pin (eg 1000 pF). AC ground pin for output
5
C1
--
0.88
6
C2
--
0.85
Note
Pin voltage values are described at VCC = 1 V.
3
PC8102T
ABSOLUTE MAXIMUM RATINGS
PARAMETER Supply Voltage Power Dissipation SYMBOL VCC PD TA = +25 C Mounted on 50 x 50 x 1.6 mm double copper clad epoxy glass PWB at TA = +85 C CONDITION RATINGS 2.2 280 UNIT V mW
Operating Temperature Storage Temperature
Topt Tstg
-40 to +85 -55 to +150
C C
RECOMMENDED OPERATING CONDITIONS
PARAMETER Supply Voltage Operating Temperature Operating Frequency SYMBOL VCC Topt fopt MIN. 0.9 -40 150 TYP. 1.0 +25 MAX. 2.0 +85 330 UNIT V C MHz
Electric characteristic (TA = +25 C, VCC = 1.0 V, ZS = ZL = 50 )
PARAMETER Circuit Current Power Gain Output 3rd order intercept point SYMBOL ICC GP OIP3 TEST CONDITIONS MIN. No input signal, TEST CIRCUIT 1 f = 280 MHz, TEST CIRCUIT 3 f1 = 150.000 MHz, f2 = 150.025 MHz TEST CIRCUIT 2 0.30 10.0 --
PC8102T
TYP. 0.5 13.5 -5 MAX. 0.65 16.5 --
UNIT mA dB dBm
Note
External matching circuits should be attached to input and output pins.
Standared characteristics for reference (Sample: ICC = 0.55 mA, Condition: TA = +25 C, VCC = 1.0 V)
PARAMETER matched with 50 Power Gain 1 Noise Figure 1 Power Gain 2 Noise Figure 2 Power Gain 3 Noise Figure 3 matched to optimize NF Power Gain 4 Noise Figure 4 Power Gain 5 Noise Figure 5 Power Gain 6 Noise Figure 6 GP4 NF4 GP5 NF5 GP6 NF6 f = 330 MHz, TEST CIRCUIT 6 f = 280 MHz, TEST CIRCUIT 4 f = 150 MHz, TEST CIRCUIT 2 19.4 2.3 14.0 2.9 11.6 3.1 dB dB dB dB dB dB GP1 NF1 GP2 NF2 GP3 NF3 f = 330 MHz, TEST CIRCUIT 5 f = 280 MHz, TEST CIRCUIT 3 f = 150 MHz, TEST CIRCUIT 2 20.6 3.6 14.7 4.0 14.5 4.1 dB dB dB dB dB dB SYMBOL CONDITIONS Reference value UNIT
4
PC8102T
TEST CIRCUIT 1
1 2 3
IN
GND
OUT
C2
6
C1
5
VCC
4
A
5
PC8102T
TEST CIRCUIT 2 (150 MHz)
7.5 pF (Note)
1 2 3
7.5 pF (Note) 10 pF 47 k
IN 68 nH 10 pF 1 000 pF C2
6
GND
OUT
84 nH
1 000 pF C1
5
VCC
4
1 000 pF
1 000 pF
Note
Matching can be adjusted with trimmer condenser.
ILLUSTRATION OF THE TEST CIRCUIT 2 ASSEMBLED ON EVALUATION BOARD
10 pF OUT 7.5pF
1 000 pF 84 nH 1 000 pF 3 2
1
C2B
47k
VCC
4 5 6
10 pF 7.5pF IN 68 nH 8102/07 1 000 pF 1 000 pF 1 000 pF
Mounting direction
Note (*1) 35 x 42 x 0.4 mm double copper clad polyimide board (*2) Back side: GND pattern (*3) Solder plated on pattern (*4) : Through holes
6
PC8102T
TEST CIRCUIT 3 (280 MHz)
0.5 pF 2 pF 5 pF 23 nH 2 pF 0.5 pF
1 2 3
23 nH
IN
GND
OUT
10 pF 47 k
1 000 pF C2
6
1 000 pF C1
5
VCC
4
1 000 pF
1 000 pF
ILLUSTRATION OF THE TEST CIRCUIT 3 ASSEMBLED ON EVALUATION BOARD
OUT 1 000 pF VCC 1 000 pF IN
1
Mounting direction
PC8102/07 TYPE2
2 pF OUT 10 pF 23 nH 2 pF 0.5 pF 1 000 pF 23 nH IN 5 pF
47 k 1 000 pF 0.5 pF
Note (*1) 35 x 42 x 0.4 mm double copper clad polyimide board (*2) Solder plated on pattern (*3) : Through holes
C2B
3 2
4 5 6
7
PC8102T
TEST CIRCUIT 4 (280 MHz)
2 pF 10 pF 27 nH 2 pF 1 000 pF C2
6 1 2 3
23 nH
IN
GND
OUT
10 pF 47 k
1 000 pF C1
5
VCC
4
1 000 pF
1 000 pF
ILLUSTRATION OF THE TEST CIRCUIT 4 ASSEMBLED ON EVALUATION BOARD
OUT 1 000 pF VCC 1 000 pF IN
1
Mounting direction
PC8102/07 TYPE2
2 pF OUT 10 pF 23 nH 2 pF 0.5 pF 1 000 pF 27 nH IN 10 pF
47 k 1 000 pF
Note (*1) 35 x 42 x 0.4 mm double copper clad polyimide board (*2) Solder plated on pattern (*3) : Through holes
8
C2B
3 2
4 5 6
PC8102T
TEST CIRCUIT 5 (330 MHz)
6 pF
1 2 3
1.5 pF 5 pF 47 k
17 nH
3 pF 1 000 pF
IN
GND
OUT
23 nH
1 000 pF C2
6
C1
5
VCC
4
1 000 pF
1 000 pF
ILLUSTRATION ON THE TEST CIRCUIT 5 ASSEMBLED ON EVALUATION BOARD
OUT 1 000 pF VCC 1 000 pF IN
1
Mounting direction
PC8102/07 TYPE2
1.5 pF OUT 47 k 1 000 pF 6 pF 5 pF 23 nH 3 pF 1 000 pF 17 nH IN
Note (*1) 35 x 42 x 0.4 mm double copper clad polyimide board (*2) Solder plated on pattern (*3) : Through holes
C2B
3 2
4 5 6
9
PC8102T
TEST CIRCUIT 6 (330 MHz)
10 pF
1 2 3
2 pF 6 pF 47 k
23 nH
3 pF 1 000 pF
IN
GND
OUT
23 nH
1 000 pF C2
6
C1
5
VCC
4
1 000 pF
1 000 pF
ILLUSTRATION ON THE TEST CIRCUIT 6 ASSEMBLED ON EVALUATION BOARD
OUT 1 000 pF VCC 1 000 pF IN
1
Mounting direction
PC8102/07 TYPE2
2 pF OUT 47 k 1 000 pF 10 pF 6 pF 23 nH 3 pF 1 000 pF 23 nH IN
Note (*1) 35 x 42 x 0.4 mm double copper clad polyimide board (*2) Solder plated on pattern (*3) : Through holes
10
C2B
3 2
4 5 6
PC8102T
CHARACTERISTICS (TA = +25 C unless otherwise specified) - TEST CIRCUIT 1 -
CIRCUIT CURRENT vs. SUPPLY VOLTAGE 5
ICC - CURCUIT CURRENT - mA
4 TA = +85C 3 TA = +25C 2 TA = -40C 1
0
0.5
1.0
1.5
2.0
2.5
VCC - SUPPLY VOLTAGE - V
- TEST CIRCUIT 2 (matched with 50 ) -
150 MHz
CH1 S11 1 U FS 1: 54.377 -5.166 205.30 nH 150.000 000 MHz
VCC = 1.0 V
CH1 S12 log
,
MAG
ICC = 0.55 mA
10 dB/ REF 0 dB
NF = 3.55 dB
1: -41.406 dB
150.000 000 MHz C2
C2
MARKER 1 150 MHz
MARKER 1 150 MHz
1 1
CENTER
CH1 O21
150.000 000 MHz MAG 10 dB/
SPAN REF 0 dB
200.000 000 MHz 1: 20.543 dB
CENTER CH1 S22
150.000 000 MHz 1: 47.934
SPAN
200.000 000 MHz
log
1 U FS
150.000 000 MHz
0.7613 826.93 pH 150.000 000 MHz
C2
MARKER 1 150 MHz
C2
1
MARKER 1 150 MHz
1
CENTER
150.000 000 MHz
SPAN
200.000 000 MHz
CENTER
150.000 000 MHz
SPAN
200.000 000 MHz
11
PC8102T
- TEST CIRCUIT 2 (matched to optimize NF) -
150 MHz
CH1 S11 1 U FS 1: 76.062 73.316 77.791 nH 150.000 000 MHz
VCC = 1.0 V
CH1 S12 log
,
MAG
ICC = 0.55 mA
10 dB/ REF 0 dB
NF = 2.25 dB
1: -43.251 dB 150.000 000 MHz
C2
C2
1
1
CENTER
150.000 000 MHz
SPAN
200.000 000 MHz
CENTER
150.000 000 MHz
SPAN
200.000 000 MHz
CH1 S21
log
MAG
10 dB/
REF 0 dB
1:
19.418 dB
CH1 S22
1 U FS
1:
53.445
150.000 000 MHz
- 1.0137 1.0467 nF 150.000 000 MHz
C2
C2
1
1
CENTER
150.000 000 MHz
SPAN
200.000 000 MHz
CENTER
150.000 000 MHz
SPAN
200.000 000 MHz
12
PC8102T
- TEST CIRCUIT 3 (matched with 50 ) -
280 MHz
CH1 S11 1 U FS 1: 84.699 -2.8789 197.44 pF 280.000 000 MHz
VCC = 1.0 V
CH1 S12 log
,
ICC = 0.55 mA
10 dB/ REF 0 dB
NF = 4.0 dB
1: -32.145 dB 260.000 000 MHz
MAG
C2 De1
C2 De1
1
1
CENTER CH1 S21 log
280.000 000 MHz MAG 10 dB/
SPAN REF 0 dB
200.000 000 MHz 1: 14.748 dB
CENTER CH1 S22
260.000 000 MHz 1: 51.172
SPAN 4.5469
200.000 000 MHz 2.5845 nH 280.000 000 MHz
1 U FS
280.000 000 MHz C2 De1 C2 De1
1 1
CENTER
280.000 000 MHz
SPAN
200.000 000 MHz
CENTER
280.000 000 MHz
SPAN
200.000 000 MHz
13
PC8102T
- TEST CIRCUIT 4 (matched to optimize NF) -
280 MHz
CH1 S11 1 U FS 1: 81.02 75.09
VCC = 1.0 V
,
ICC = 0.55 mA
CH1 S12 log MAG
TA = 25 C
10 dB/ REF 0 dB
NF = 2.93 dB
1: -33.561 dB
42.682 nH 280.000 000 MHz
280.000 000 MHz C2 De1
C2 De1
1
1
CENTER CH1 S21 log
280.000 000 MHz MAG 10 dB/
SPAN REF 0 dB
200.000 000 MHz 1: 14.087 dB
CENTER CH1 S22
280.000 000 MHz 1 U FS 1: 56.415
SPAN
200.000 000 MHz
280.000 000 MHz C2 De1 C2 De1
-6.4043 67.633 pF 280.000 000 MHz
1 1
CENTER
280.000 000 MHz
SPAN
200.000 000 MHz
CENTER
280.000 000 MHz
SPAN
200.000 000 MHz
14
PC8102T
- TEST CIRCUIT 5 (matched with 50 ) -
330 MHz
CH1 S11 1 U FS 1: 57.111 11.426
VCC = 1.0 V
5.5105 nH 330.000 000 MHz
,
ICC = 0.55 mA
CH1 S12 log MAG
NF = 4.1 dB
10 dB/ REF 0 dB 1: -30.38 dB 330.000 000 MHz
C2 De1
C2
1
1
CENTER CH1 S21 log
330.000 000 MHz MAG 10 dB/
SPAN REF 0 dB
200.000 000 MHz 1: 14.479 dB
CENTER CH1 S22
330.000 000 MHz 1: 60.922
SPAN
200.000 000 MHz
1 U FS
330.000 000 MHz C2 De1 C2 De1
- 91.797 5.2539 nF 330.000 000 MHz
1 1
CENTER
330.000 000 MHz
SPAN
200.000 000 MHz
CENTER
330.000 000 MHz
SPAN
200.000 000 MHz
15
PC8102T
- TEST CIRCUIT 6 (matched to optimize NF) -
330 MHz
CH1 S11 1 U FS 1: 157.77 -17.273 27.921 pF 330.000 000 MHz
VCC = 1.00 V
CH1 S12 log MAG
,
ICC = 0.55 mA
10 dB/ REF 0 dB
NF = 3.14 dB
1: -30.649 dB
330.000 000 MHz C2 De1
C2 De1
1
1
CENTER CH1 S21 log
330.000 000 MHz MAG 10 dB/
SPAN REF 0 dB
200.000 000 MHz 1: 11.58 dB
CENTER CH1 S22
330.000 000 MHz 1 U FS 1: 47.793
SPAN
200.000 000 MHz
330.000 000 MHz C2 De1
-6.7441 71.512 pF 330.000 000 MHz
C2 De1
1 1
CENTER
330.000 000 MHz
SPAN
200.000 000 MHz
CENTER
330.000 000 MHz
SPAN
200.000 000 MHz
16
PC8102T
- TEST CIRCUIT 2 -
IM3 AND OUTPUT LEVEL vs. INPUT LEVEL (150 MHz) +10
0
-10
3rd order intermodulation distortion IM3 (dBm)
-20
Output level Pout [dBm]
POUT -30
-40 IM3 -50
-60
-70
-80 -70
-60
-50
-40
-30
-20
-10
INPUT LEVEL Pin [dBm]
17
PC8102T
6 PIN MINI MOLD PACKAGE DIMENSIONS (Unit: mm)
+0.1
0.3 -0.05
0.13 0.1
1 2.8 -0.3 1.5 -0.1
+0.2 +0.2
2
3
0 to 0.1 6 5 0.95 1.9 2.9 0.2 4 0.95 0.8 1.1 -0.1
+0.2
18
PC8102T
NOTE ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). (3) Keep the track length of the ground pins as short as possible. (4) The bypass capacitor (eg 1 000 pF) should be attached to the VCC pin. (5) The matching circuit must be each attached to input and output pins. RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives.
PC8102T
Soldering process Infrared ray reflow Soldering conditions Package peak temperature: 235 C, Hour: within 30 s. (more than 210 C), Time: 3 time, Limited days: no.* Package peak temperature: 215 C, Hour: within 40 s. (more than 200 C), Time: 3 time, Limited days: no.* Soldering tub temperature: less than 260 C, Hour: within 10 s. Time: 1 time, Limited days: no.* Pin part heating Pin area temperature: less than 300 C, Hour: within 3 s/pin. Limited days: no.* Recommended condition symbol IR35-00-3
VPS
VP15-00-3
Wave Soldering
WS60-00-1
* It is the storage days after opening a dry pack, the storage conditions are 25 C, less than 65 % RH. Note The combined use of soldering method is to be avoided (However, except the pin area heating method).
For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535EJ7V0IF00).
19
PC8102T
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices in "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact NEC Sales Representative in advance. Anti-radioactive design is not implemented in this product.
M4 94.11
20

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